Inevitably, it may interfere with heat dissipation and cause throttling.
So, X3D CPUs
Due to heat generation issues, there is no choice but to release power and clock speeds significantly lower than existing CPUs.
However, this time, TSMC made the cache area smaller, making it easier for heat to escape.
It is a well-established belief that the cache area cannot be reduced any further even with the original 3nm process, but TSMC has achieved that.
+ Not only does it stack on top, but it also does the process of laying some of the cache underneath. (Is this happening?)
As a result, it is possible to hit more cache and provides room to increase the voltage clock.
AMD is partnering with TSMC like this.
The fate of Intel, which declared TSMC an enemy company that must be overthrown…
(If you want to catch up or steal technology, you have to pretend to be friendly and do it secretly. If you declare war right away, you become an asshole.)